发明名称 METHOD FOR BONDING WIRE
摘要 PURPOSE: A method for bonding wire is provided to reduce a height difference between a first and a second bonding points and to maintain a safe wire loop shape strongly by raising a capillary upwards or askew upwards. CONSTITUTION: A wire(3) penetrating a capillary(4) is connected between a first bond point(A) and a second bonding point(G). A ball is formed with a front end of the wire(3) extended from a front end of the capillary(4), and the capillary(4) is raised while unwinding the wire(3) from the front end of the capillary(4). The capillary(4) is lowered up to a position over the second bonding point(G) approached to the side of the first bonding point(A) rather than the side of the second bonding point(G). When the capillary(4) is raised askew, a raising direction of the capillary(4) is along with a camper surface.
申请公布号 KR20000023471(A) 申请公布日期 2000.04.25
申请号 KR19990041429 申请日期 1999.09.28
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 NISHIURA SHINICHI;MOCHIDA TOORU
分类号 H01L21/60;B23K20/00;H01L21/607 主分类号 H01L21/60
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