发明名称 |
COOLING APPARATUS OF CONNECTING SEMICONDUCTOR FABRICATION EQUIPMENT WITH CHILLER |
摘要 |
PURPOSE: A cooling apparatus of connecting a semiconductor fabrication equipment with a chiller is to exchange an element of the semiconductor fabrication equipment connected to the chiller without turning off a power connected to the chiller and thereby extend the life of the chiller. CONSTITUTION: A cooling apparatus comprises: a coolant supply part(104) and a cool antoutlet part(106); a bypass line(108) for connecting the coolant supply part and the coolant outlet part to each other; a first and second opening/closing valve installed respectively at the coolant supply part and the coolant outlet part; a third opening/closing valve installed at the bypass line. A semiconductor fabrication equipment (100) is connected to a chiller(102) through the coolant supply part, the coolant outlet part, and the bypass line. When it is necessary to exchange an element of the semiconductor fabrication equipment, the first and second valves are closed and the third valve is opened such that the coolant is introduced into the semiconductor fabrication equipment.
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申请公布号 |
KR20000021298(A) |
申请公布日期 |
2000.04.25 |
申请号 |
KR19980040314 |
申请日期 |
1998.09.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HEO, SEONG TAE |
分类号 |
H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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