| 摘要 |
PURPOSE: A carrier and a polishing apparatus are provided to mass-produce wafers as use a retainer ring made of soft materials. CONSTITUTION: A carrier comprises: a carrier substance(2) having a pressure chamber formed by a concave part, of which lower part is covered with a flexible sheet(4,102), opened to lower direction; a retainer ring(3,104) sticked to a circumference of the lower part of the flexible sheet(4,102) and supporting a wafer made of soft material; a flexible margin block(40) protruded to a same thickness with bottom surface of the flexible sheet(4,102) arranged at the inside of the retainer ring(3,104), wherein the thickness of the retainer ring(3,104) is determined to be same with the sum of thicknesses of the margin block(40) and the polished wafer. |
