发明名称 RESIN COMPOSITION WITH IMPROVED INFLATION-FILM MOLDABILITY OR FILM
摘要 PROBLEM TO BE SOLVED: To provide resin compositions capable of stably producing inflation films even with increased blow-up ratios and enlarged lip gaps in molding inflation films. SOLUTION: Resin compositions comprise 98-70 wt.% polyolefin resin which meets the relationship between the melt flow rate(MFR) at 230 deg.C and the melt tension(MT) at 230 deg.C represented by formula I: MT<11.32+MFR-0.7854 and 2-30 wt.% high melt strength polypropylene resin which meets the relationship between the melt flow rate(MFR) at 230 deg.C and the melt tension(MT) at 230 deg.C represented by formula II: 11.32×MFR-0.7854<=MT.
申请公布号 JP2000119451(A) 申请公布日期 2000.04.25
申请号 JP19980290454 申请日期 1998.10.13
申请人 MONTERU J P O KK 发明人 IZUMI ZENICHIRO;KANAZAWA SHUJI
分类号 C08J5/18;B29C55/28;B29K23/00;B29L7/00;B29L9/00;C08L23/00;C08L23/08;C08L23/10;C08L53/00;(IPC1-7):C08L23/00 主分类号 C08J5/18
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