发明名称 FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a floor structure which is hard to generate noise by laminating a sound insulation sheet between a floor material and a floor substrate and an elastic material layer between the floor material and/or the floor substrate. SOLUTION: An uncured modified silicone-based adhesive to prepare an elastic material layer 4 is evenly applied on a floor substrate 2 so that the thickness after setting is as thick as 0.1-10 mm. Thereafter, a sheet 3 having a sound insulating property is attached with pressure. Further, an uncured modified silicone-based adhesive is evenly applied thereon so that the thickness after setting is as thick as 0.1-10 mm. Thereafter, a floor material is attached with pressure thereon. In this way, since an elastic material layer having 50% or more in the elongation at break in a tensile test and 10% or less in the permanent elongation in a permanent elongation test, made of a modified silicone-based adhesive is laminated between the floor material and the floor substrate material, the elastic material layer sufficiently absorbs stresses generating when the floor structural body is deformed and hence, no creaking noise arises and since a sound insulation sheet is put between them, noise is prevented all the more.
申请公布号 JP2000120257(A) 申请公布日期 2000.04.25
申请号 JP19980296813 申请日期 1998.10.19
申请人 SEKISUI CHEM CO LTD 发明人 YAMAUCHI YASUSHI
分类号 E04F15/18;E04F15/20;(IPC1-7):E04F15/20 主分类号 E04F15/18
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