| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for preserving an adhesive cured silicone sheet which allows little change of the adhesion property during preservation, does not attach to its protective agent, maintains a high adhesion against various articles or members after a long-term preservation after preparation, especially allows a high adhesion of a semiconductor chip to a chip fitting part and yields a semiconductor device having a high reliability. SOLUTION: An adhesive cured silicone sheet, prepared by curing a curable silicone composition, e.g. a hydrosilylation-curable silicone composition containing an adhesion-imparting agent, between releasable substrates into a sheet form, is preserved in an atmosphere wherein the relative moisture is smaller than 50%, preferably smaller than 25%, e.g. in a sealed container with an absorbent.
|
