METHOD FOR REMOVING SEMICONDUCTOR WAFER

摘要

PURPOSE: A method for removing a semiconductor wafer is provided to improve removement of a wafer from a polishing pad after polishing process. CONSTITUTION: A slurry(108) is applied to a polishing pad(104). The polishing pad(104)having the slurry(108) on it is rotated during pressure is applied to a wafer(102). Water(124) is supplied to the polishing pad(104). Rotation speed of the polishing pad(104) is increased for removing a part of the slurry(108). The pressure is decreased during increasing of the rotation speed for preventing substantially additional polishing. The wafer(102) is removed from the polishing pad(104). The polishing pad(104) rotates in speed of about 20 to 100 rotation per a minute. At step of rotating of the polishing pad, pressure of about 2 to 8 psi is applied to the wafer(102) and the polishing pad(104).