INTERPOSER FOR RECESSED FLIP CHIP PACKAGE

摘要

PURPOSE: An interposer for recessed flip chip package is provided to interconnect a plurality of levels by combining an IC chip to a silicon automatic transmitter and forming an IC power, a power for ground interconnecting units, and ground surfaces on divided interconnecting unit levels of the automatic transmitter. CONSTITUTION: An automatic transmitter(21) is soldered to a next board level(52) by interconnecting units(51). An IC chip is recessed. The board level(52) is an intermediate board level or a system printed wire board(PWB) such as a mother board. Solder balls for interconnecting the automatic transmitter(21) to the board level(52) is greater than balls for interconnecting the IC chip to the automatic transmitter(21). Interconnecting units with 5 rows are formed in an overlap region.