METHOD FOR SEALING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT CHIP DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT CARD

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit chip device having a high strength and small unevenness in a shape and a sealing thickness. SOLUTION: The semiconductor integrated circuit chip CP is adhered onto a board FB formed with a circuit pattern, electrodes of the chip CP are connected to a circuit pattern, the chip CP is coated with a predetermined amount of sealing resin SP', and a reinforcing metal plate MP is arranged on the resin SP'. Further, the resin SP' is pressurized with the plate MP to allow the resin SP' to flow to a periphery of the chip CP and the resin SP' cast to the periphery of the chip COP is cured.