发明名称 HEAT INSULATING MOLD, MANUFACTURE THEREOF AND MASKING MATERIAL
摘要 PROBLEM TO BE SOLVED: To prevent separations and damages from developing in a heat insulating polymer film left behind a mold by a method wherein the end edge of a lower layer masking material is somewhat retreated from a boundary between a region covered by a heat insulating polymer film and a region, in which the heat insulating polymer film lacks so as to provide a gap between the end edge part of an upper layer masking material and the mold along the above-mentioned boundary. SOLUTION: An aromatic polyamide film having the thickness of 50μm as a lower layer masking material 7B is cut to the form of a mating surface 5 for covering. At this time, the cavity side end edge of the lower layer masking material 7B is retreated by 0.5 mm from an edge E. Further, on the lower layer masking material 7B, an aromatic polyamide film having the thickness of 100μm as an upper layer masking material 8B is cut to respective shapes for covering under the condition that the cavity side end edge of the upper layer masking material 8B is put in line with an edge E. Concretely, a gap G1 is provided between the upper masking material 8B and a mold 1. In addition, permanent magnets 9 are placed so as to prevent the positional shifting between the lower layer masking material 7B and the upper layer masking material 8B.
申请公布号 JP2000117747(A) 申请公布日期 2000.04.25
申请号 JP19980292154 申请日期 1998.10.14
申请人 ULVAC JAPAN LTD 发明人 IIDA KEIKO
分类号 B29C33/38;(IPC1-7):B29C33/38 主分类号 B29C33/38
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