METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER

摘要

PURPOSE: An apparatus for etching a semiconductor wafer is provided to precisely control a profile and speedily etch the wafer by a physical and chemical etching. CONSTITUTION: A method for etching a semiconductor wafer(40) includes a tow step physical and chemical etching. process in order to create vertical side walls (20) required for high density DRAMs and FRAMs. The physical etching process generates a necessary vertical side walls of profiles and an unnecessary veils at the same time. The chemical etching is executed in the continuous process and the veils is eliminated by the chemical etching.