发明名称 THERMOSETTING RESIN COMPOSITION AND ITS FORMED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition excellent in mold release characteristics, water repellency, stain resistance and transparency and a formed product obtained by hardening the composition. SOLUTION: This thermosetting resin composition and this formed product obtained by hardening the thermosetting resin composition comprise 100 pts.wt. of (A) a thermosetting organic resin and 0.1-200 pts.wt. of (B) an organosilicon compound expressed by the formula: [X is a radically polymerizable organic group, R is H or a nonsubstituted monovalent hydrocarbon group, R' is a 1-10C alkyl, (a) is 2-3 in average].
申请公布号 JP2000119351(A) 申请公布日期 2000.04.25
申请号 JP19980297041 申请日期 1998.10.19
申请人 DOW CORNING TORAY SILICONE CO LTD 发明人 FURUKAWA HARUHIKO;YOSHITAKE MAKOTO;UEKI HIROSHI;MORITA YOSHIJI
分类号 C04B24/42;C04B26/02;C08F230/08;C08F265/06;C08F283/01;C08F290/02;C08F290/08;(IPC1-7):C08F290/02 主分类号 C04B24/42
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