发明名称 |
THERMOSETTING RESIN COMPOSITION AND ITS FORMED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition excellent in mold release characteristics, water repellency, stain resistance and transparency and a formed product obtained by hardening the composition. SOLUTION: This thermosetting resin composition and this formed product obtained by hardening the thermosetting resin composition comprise 100 pts.wt. of (A) a thermosetting organic resin and 0.1-200 pts.wt. of (B) an organosilicon compound expressed by the formula: [X is a radically polymerizable organic group, R is H or a nonsubstituted monovalent hydrocarbon group, R' is a 1-10C alkyl, (a) is 2-3 in average].
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申请公布号 |
JP2000119351(A) |
申请公布日期 |
2000.04.25 |
申请号 |
JP19980297041 |
申请日期 |
1998.10.19 |
申请人 |
DOW CORNING TORAY SILICONE CO LTD |
发明人 |
FURUKAWA HARUHIKO;YOSHITAKE MAKOTO;UEKI HIROSHI;MORITA YOSHIJI |
分类号 |
C04B24/42;C04B26/02;C08F230/08;C08F265/06;C08F283/01;C08F290/02;C08F290/08;(IPC1-7):C08F290/02 |
主分类号 |
C04B24/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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