发明名称 |
Guide mechanism for aligning a handheld vacuum pickup wand with a selected wafer in a cassette |
摘要 |
A guided vacuum pick-up device for picking up wafers in a wafer storage cassette and a method for using such device. In the device, a vacuum pick-up head is equipped with a guide member which intimately engages a guide bar molded on a wafer storage cassette such that the movement of the vacuum pick-up head can be precisely indexed to the spacing between the adjacent wafers by engaging a guide pin on the guide member to one of a number of positioning grooves provided circumferentially on the guide bar. The device can be used for picking up or putting back wafers in a wafer storage cassette without the danger of scratching or breaking the wafers by accidentally colliding with the wafers.
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申请公布号 |
US6053689(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19990323364 |
申请日期 |
1999.06.01 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LI, MENG CHUN |
分类号 |
H01L21/683;(IPC1-7):B66C1/02 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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