EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE OBTAINED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, having a good molding property and working property, and also capable of obtaining a semiconductor device excellent in solder-resistance. SOLUTION: This epoxy resin composition for sealing a semiconductor contains specific components of (A) the following epoxy compound, (B) a phenol resin and (C) the following mixture of fused silica powder. (A) An epoxy compound obtained by performing an addition reaction of a mixed polyphenol obtained by mixing (a1) a biphenol expressed by the general formula (R1 to R4 are each hydrogen or a 1-5C alkyl group) and (a2) a biphenol (a polyphenol except for a1) in a weight mixing ratio (a1/a2) of (5/95)-(40/60) with an epihalohydrin. (C) A mixture of 3 kinds of fused silica powders having different mean particle diameters.