发明名称 Method of and apparatus for removing metallic impurities diffused in a semiconductor substrate
摘要 A method of removing metallic impurities diffused in a semiconductor substrate, comprising, the semiconductor-substrate-heating step of heating a semiconductor substrate to at least 200 DEG C. or higher and promoting the release and rediffusion of metallic impurities diffused in the semiconductor substrate, and the metallic-impurity-removing step of dissolving the metallic impurities arrived at the surface of the semiconductor substrate with a chemical agent and removing them from the substrate.
申请公布号 US6054373(A) 申请公布日期 2000.04.25
申请号 US19980006996 申请日期 1998.01.14
申请人 KABUSHIKI KAISHA TOSHIBA;PUREX CO., LTD.;TOSHIBA CERAMICS CO., LTD. 发明人 TOMITA, HIROSHI;MURAOKA, HISASHI;TAKEDA, RYUJI
分类号 H01L21/304;H01L21/00;H01L21/322;(IPC1-7):H01L21/322 主分类号 H01L21/304
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