发明名称 |
Method of and apparatus for removing metallic impurities diffused in a semiconductor substrate |
摘要 |
A method of removing metallic impurities diffused in a semiconductor substrate, comprising, the semiconductor-substrate-heating step of heating a semiconductor substrate to at least 200 DEG C. or higher and promoting the release and rediffusion of metallic impurities diffused in the semiconductor substrate, and the metallic-impurity-removing step of dissolving the metallic impurities arrived at the surface of the semiconductor substrate with a chemical agent and removing them from the substrate.
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申请公布号 |
US6054373(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19980006996 |
申请日期 |
1998.01.14 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;PUREX CO., LTD.;TOSHIBA CERAMICS CO., LTD. |
发明人 |
TOMITA, HIROSHI;MURAOKA, HISASHI;TAKEDA, RYUJI |
分类号 |
H01L21/304;H01L21/00;H01L21/322;(IPC1-7):H01L21/322 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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