| 发明名称 |
GRINDING METHOD AND MACHINE FOR EDGE OF DISK OR WAFER |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding machine for grinding the edge of a disk or a wafer. SOLUTION: A grinding machine includes a groove-attached grinding wheel, a means for transferring a wafer before and after grinding, and a housing 332; and a wafer 340 is placed on a vacuum chuck 336 for waiting inspection in the housing 332. A nozzle 338 is protruded into the housing to guide water or air to the surface and edge of the wafer on the chuck, and then a transferring means transfers the water to an inspection station. |
| 申请公布号 |
JP2000117602(A) |
申请公布日期 |
2000.04.25 |
| 申请号 |
JP19980365011 |
申请日期 |
1998.12.22 |
| 申请人 |
UNOVA UK LTD |
发明人 |
STOCKER MARK ANDREW;FALKNER DERMOT ROBERT;MORANTZ PAUL MARTIN;PIERSE MICHAEL GEORGE |
| 分类号 |
B24B41/06;B23Q1/36;B23Q3/18;B23Q17/24;B24B1/00;B24B5/04;B24B5/06;B24B9/00;B24B9/06;B24B17/04;B24B17/06;B24B19/02;B24B41/00;B24B41/02;B24B41/04;B24B47/12;B24B49/00;B24B49/02;B24B49/12;B24B53/00;B24B53/07;B24B55/02;H01L21/00;H01L21/304;H01L21/306;H01L21/66;(IPC1-7):B24B9/00 |
主分类号 |
B24B41/06 |
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