发明名称 COPPER ALLOY FOR LEAD FRAME EXCELLENT IN ETCHING WORKABILITY AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To improve the fine workability, etching rate and strength of an alloy in etching working by composing it of a specified compsn. contg. Ni, Sn, P, and the balance Cu with inevitable impurities and controlling the crystal grain size to a specified range in the sheet thickness direction. SOLUTION: This alloy is composed of, by weight, 0.1 to 3.0% Ni, 0.5 to 2.0% Sn, 0.005 to 0.20% P, and the balance Cu with inevitable impurities. Then the crystal grain size in the sheet thickness direction is 0.5 to 15μm. Moreover, preferably, the size of precipitates is <=100 nm and the weight percentage ratio of Ni/P is 10 to 50. In the production of the alloy, for controlling the crystal grain size to 0.5 to 15μm, the annealing conditions before the final rolling stage are controlled to 300 to 700 deg.C and 0.01 to 12 hr, and, after that, cold rolling is executed at a draft of >=10%. Moreover, for dispersedly precipitating Ni-P compds. of <=100 nm size, it is cooled at a cooling rate of >=1 deg.C/sec in the range of 700 to 300 deg.C, the rolling working ratio is controlled to >=50%, and the annealing conditions are controlled to 400 to 650 deg.C and 1 to 720 min.
申请公布号 JP2000119779(A) 申请公布日期 2000.04.25
申请号 JP19980330114 申请日期 1998.10.15
申请人 DOWA MINING CO LTD 发明人 WATANABE KOJI;KATAOKA MASAHIRO;SUGAWARA AKIRA;TAKASE SATOSHI;TO JUSHIN
分类号 H01L23/48;C22C9/02;C22C9/06;C22F1/00;C22F1/08;(IPC1-7):C22C9/06 主分类号 H01L23/48
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