发明名称 |
Method of making an electronic apparatus casing |
摘要 |
A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO2 and Na2O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.
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申请公布号 |
US6054174(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19970974963 |
申请日期 |
1997.11.20 |
申请人 |
SONY CORPORATION |
发明人 |
KAKIZAKI, MASAHIKO;SHIMOUCHI, TAKAHIRO |
分类号 |
B05D7/14;C23C18/52;C23C28/00;G11B33/02;G11B33/14;H05K5/02;(IPC1-7):B05D5/12 |
主分类号 |
B05D7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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