发明名称 Method of making an electronic apparatus casing
摘要 A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO2 and Na2O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.
申请公布号 US6054174(A) 申请公布日期 2000.04.25
申请号 US19970974963 申请日期 1997.11.20
申请人 SONY CORPORATION 发明人 KAKIZAKI, MASAHIKO;SHIMOUCHI, TAKAHIRO
分类号 B05D7/14;C23C18/52;C23C28/00;G11B33/02;G11B33/14;H05K5/02;(IPC1-7):B05D5/12 主分类号 B05D7/14
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