发明名称 |
Copper electroless deposition on a titanium-containing surface |
摘要 |
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
|
申请公布号 |
US6054172(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19990257854 |
申请日期 |
1999.02.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
ROBINSON, KARL;TAYLOR, TED |
分类号 |
C23C18/18;C23C18/40;H01L21/288;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):B05D5/12 |
主分类号 |
C23C18/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|