SEMICONDUCTOR COMPONENT FOR MOUNTING, MOUNTING STRUCTURE AND METHOD

摘要

PURPOSE: A semiconductor component for mounting, a mounting structure and a mounting method is provided to increase the contact strength between components to be mounted and a printed circuit board and to provide a sufficient margin to wire pitch among terminals. CONSTITUTION: A component for mounting has area terminals(7) on a substrate(6). The area terminals (7) consists of area terminals(7b) arranged at the outer circumference of the substrate and area terminals(7a) arranged at the inner circumference of the substrate(6). The area terminals(7b) on the outer circumference are arranged in a larger pitch than the area terminals(7a) on the inner circumference. The area terminals(7) are arranged in a flip chip bump array and arranged on a chip size package interposer substrate(6).