| 摘要 |
PURPOSE: A substrate for mounting semiconductor elements and a method for manufacturing the same are provided to realize a structure of mass production and a low cost by abbreviating an exciter laser and an adhesive layer. CONSTITUTION: A substrate for mounting semiconductor elements comprises an insulated substrate, a first circuit pattern(1), an insulated layer(5), a contact portion(7), a conductive layer(2), and an open hole(4a). A method for manufacturing the same comprises the steps of: manufacturing a substrate member; forming an insulated layer for covering an insulated layer by using an insulated material; forming a penetrating hole(7) on the insulated layer and exposing a first circuit pattern into the penetrating hole; forming a first contact conductive path(7a) for penetrating the insulated layer; and forming an open hole penetrating a conductive layer and the insulated substrate and exposing the first circuit pattern into the open hole. |
