| 摘要 |
PURPOSE: A bump is provided to mitigate the thermal stress applied between a semiconductor device and a printed circuit board and to strengthen the strength of a junction part without using an encapsulation resin. CONSTITUTION: The bump includes a first ball bump(20) which is relatively elastic and is formed on an electrode pad comprised on a semiconductor device, as well as includes a second ball bump(22) formed so as to be overlapped with the first ball bump at least in a vertical direction to the electrode pad. The second ball bump has a different material and different components from the first ball bump. |
