发明名称 BOARD DIVIDING DEVICE
摘要 PROBLEM TO BE SOLVED: To remove dusts developing at the cutting of a board so as to prevent mounted parts and the surface of a main body board from being stained with the dusts by a method wherein the air near a groove part is sucked for a predetermined period of time when the holding of a plate-like board under the state that its groove part is exposed beyond the upper end of a jig is detected at the insertion of a disused board in the jig. SOLUTION: A recessed part 16a is formed in a jig 16, which holds the plate-like board 11, of a board dividing device 15 so as to hole the plate-like board 11 under the state that a groove part 13a is exposed beyond the upper end of the jig 16 when a disused boaed 14a is inserted in the recessed part. A light emitting sensor 17 and a light receiving sensor 18 are provided above the jig 16 so as to detect a main body board 12 when the plate-like board 11 is held. A nozzle 20 provided near the jig 16 is connected through a piping 22 to a suction pump 21 so as to be actuated by the command signal of a controller 19 cut to the detection information of the light receiving sensor 18 in order to suck the air near the groove part 13a and a cutting part when the plate-like board 11 is held in the jig 16 and the dusts developing at the cutting of the main body board 12 off the disused board 14a. Thus, mounted parts and the surface of the main body board 12 are prevented from being stuck and stained with the dusts.
申请公布号 JP2000117727(A) 申请公布日期 2000.04.25
申请号 JP19980288437 申请日期 1998.10.09
申请人 SUMITOMO WIRING SYST LTD 发明人 OKAZAKI KIKUO
分类号 B28D5/00;H05K3/00;(IPC1-7):B28D5/00 主分类号 B28D5/00
代理机构 代理人
主权项
地址