| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of cracking of an IC chip and/or the disconnection of a line due to the bending and pushing overload to a card by providing half cut grooves at the borders between an operation area provided on the IC chip and dummy areas. SOLUTION: An IC chip 1 which is provided with an operation area 1a where a normal circuit is formed and dummy areas 1b around it and forms half cut grooves 2 between them is used. What is formed on a wafer is cut and divided by a dicing saw, etc., in pitch made as wide as the interval of the dummy areas 1b, and at that time, the part of the operation area 1a is manufactured by forming half cut grooves 2 by using the same dicing saw. Thus, when an IC is cracked because bending, pushing overload, etc., are applied to the IC card, the parts of the half cut grooves 2 are first divided, and after that, the dummy areas 1b function as a protective member for the area 1a so that the cracking of the area 1a can be hard to make. |
