| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a beam sensor having precisely reproducible characteristics, and to manufacture a beam sensor equipped with a plurality of individual sensor elements which can be arranged with fine intervals independently of the thickness of a substrate to be used. SOLUTION: At least one area 12 in which an opening 4 should be formed in a semiconductor substrate 1 is set on the surface of the semiconductor substrate. Then, a film 13 is deposed on the surface. Also, a beam sucker 5 is mounted on the set area 12 on the film 13. Moreover, a thermocouple 6 equipped with a thermocontact thermally brought into contact with the beam sucker 5 and a cold junction 7 thermally brought into contact with the semiconductor substrate 1 is mounted. In this case, an opening is formed in the film 13 in the set area 12, and the semiconductor substrate 1 is etched through the opening.
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