| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which such a substrate material for printed circuit can be manufactured that can secure good electrical continuity and, when used, its thermal expansion can be controlled so as to prevent the peeling of a conductive layer from the material and an insulating material from a wire. SOLUTION: A substrate material for printed circuit is manufactured in such a way that, a wire structure 18 in which wires 12 are three-dimensionally stretched at prescribed pitches is obtained by attracting the wires 12 at prescribed pitches in a plane between both side sections facing each other and fixing the front ends of the wires 12 at one side section, and then, attracting the wires 12 upward or downward with magnets 16 and 17 arranged at prescribed upper and lower positions. Then the wire structure 18 is set up in a mold and a composite material composed of a plastic and a ceramic is poured in the mold and hardened. After the composite material is hardened, the composite material is sliced into pieces across the stretched wires 12.
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