| 摘要 |
PROBLEM TO BE SOLVED: To reduce short circuit between adjacent inner leads by preventing electrical contact between adjacent inner leads. SOLUTION: A semiconductor chip 2 is die-bonded to a die pad 1a. Bonding pads 3 on the surface of the semiconductor chip 2 and a first surface which is the top of inner lead frames 1b are electrically connected through wires 4 to form a semiconductor device. In this case, insulating films 5 are formed on ends of the inner lead frames 1b other than the first surface, namely on a second surface of the inner lead frame 1b approximately orthogonal to the first surface and on a third surface opposite to the first surface. |
