发明名称 STRUCTURE AND METHOD FOR POSITIONING CIRCUIT BOARD AND ADHESIVE-SUPPLYING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To preventing the deterioration of the positioning operation of a circuit board and adverse influence to the bonding performance of electronic parts by preventing the occurrence of flash rubbish or a powder foreign matters due to the positioning operation of the circuit board. SOLUTION: Structure 16 for positioning a circuit board is provided with a circuit board 14 that has a reference hole 14a for positioning, a substrate placement member 84 that places the circuit board 14, a substrate-positioning member 18 that is fitted to the reference hole 14a for positioning the circuit board 14, and a cover member 72 that is provided while being freely opened and closed and presses down the circuit board 14 at a part to the substrate placement member 84 by changing from opening to closing state. In this case, as the positioning member 18, a spherical member for fitting to the reference hole 14a is used.
申请公布号 JP2000114796(A) 申请公布日期 2000.04.21
申请号 JP19980282888 申请日期 1998.10.05
申请人 SONY CORP 发明人 HONMA YASUTAKA;MIYASHIRO TAKAAKI
分类号 H05K13/04;C09J5/00 主分类号 H05K13/04
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