| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection technique capable of testing a semiconductor wafer, LSI package, etc., by using high frequency at high speed. SOLUTION: Constituted are of a contact structure 30 formed with conductive material on a contact substrate 20 by photolithography production method, a contact trace 32 of which one end is electrically connected to the contact structure and the other end is lead to the end of the contact substrate, a printed circuit substrate pad 38 placed on the printed circuit substrate 62 for electrically connecting with the other end of the contact trace, an elastomer 42 placed at the lower part of the contact substrate for giving flexibility to the packaging/ mutual connection, and a support structure 52 placed between the elastomer and the printed circuit substrate and supporting the contact structure, contact substrate and the elastomer. |
