| 摘要 |
PROBLEM TO BE SOLVED: To prevent undue projection of adhesive form adhesive layers formed on the opposite sides of an insulation film by setting the melting viscosity of the adhesive on the semiconductor chip side higher than that of the adhesive on the external wired joint member side at the hot press temperature thereby eliminating voids from the adhesion interface between the joint member and the semiconductor chip. SOLUTION: An adhesive has a semi-cured thermosetting resin layer 5 formed on the opposite sides of a core material, i.e., a heat resistant thermoplastic film 4, where the adhesive on the semiconductor chip side is cured more than the adhesive on the external wired joint member side so that the melting viscosity will be different on the opposite sides. In order to fill the irregularities formed on the surface of the external wired joint member due to a wiring layer or lands at hot press, melt viscosity of the adhesive on the external wired joint member side is preferably set in the range of 1 to 5×104 [P] at the hot press temperature. The melting viscosity of the adhesive on the semiconductor chip side is preferably set in the range of 2 to 8×104 [P] at the hot press temperature and is set higher than that of the adhesive on the external wired joint member side.
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