| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which a circuit wiring layer can be formed at a high density by using a thin film-forming technique and, at the same time, the electrode of a semiconductor element, capacitance element, resistor, etc., can be surely and firmly connected electrically to the circuit wiring layer through a brazing filler material having a low melting point. SOLUTION: A wiring board is constituted by providing a circuit wiring layer 2 which is formed by a thin film forming technique and to which electronic parts A are connected through a brazing filler material 6 on an insulating substrate 1. The wiring layer 2 is formed in a three-layer structure composed of an adhesive layer 3, barrier layer 4, and a gold main conductor layer 5 from the substrate 1 side and the main conductor layer 5 partially has a nonforming area 7 where the electronic parts A are connected to the wiring layer 2.
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