发明名称 APPARATUS AND METHOD FOR POLISHING OF SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To obtain an apparatus and a method, in which the damage of a polishing cloth in a dressing operation is reduced as far as possible in which the life cycle of the polishing cloth is made long, and in which the clogging of a dresser is eliminated by a method wherein the dresser which contains an SiC film is used in a dressing process by the polishing cloth. SOLUTION: An SiC dresser has a structure in which a plurality of pellets 2 are attached to a discoidal dresser 1. The plurality of pellets 2 are attached so as to surround the circumference of the discoidal dresser 1. (c) The number of pellets is preferably set at eight or higher so that the respective pellets come into contact uniformly with a polishing cloth in a dressing operation. Every pellet 2 has a structure, in which an SiC film 5 is pasted on an Al base metal 3 by an epoxy-based adhesive 4. (b) In this case, as an adhesive, it is preferable to use an abrasive in which SiN particles as abrasive particles are added to an acidic solution. When acidic abrasive is used, the surface of the SiC dresser will not be modified.
申请公布号 JP2000114215(A) 申请公布日期 2000.04.21
申请号 JP19980284272 申请日期 1998.10.06
申请人 TOSHIBA CORP 发明人 DOI KENJI;IZAKI AKIHISA;MIYASHITA NAOTO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址