| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for measuring adhesion of a fine particle to a work, i.e., a thin film, directly. SOLUTION: A fine particle adhering to the surface of a thin film chip 1 is observed and the mass and position thereof are determined from the size. It is then irradiated with a pulse laser light 6 and fluctuation in the intensity distribution of laser reflected light 4 is measured by a multi-split photodetector 5 in order to measure positional fluctuation of the thin film thus measuring an acceleration generated in the thin film. Consequently, a force being applied to each fine particle can be determined. After irradiating the pulse laser light 6, the fine particle on the surface of the thin film chip 1 is observed again in order to check removal of the fine particle. The force applied to the fine particle is higher than the adhesion if the fine particle is removed, otherwise the force applied thereto is lower than the adhesion. Adhesion can be determined by performing the measurement while varying the intensity of the pulse laser light 6.
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