| 摘要 |
PROBLEM TO BE SOLVED: To enable characteristics check without opening a package, and facilitate characteristics check after assembly, by involving a characteristics check element, and equipping an I/O pad to be bonded at the time of assembly with the characteristics check element with which an I/O terminal is connected. SOLUTION: This semiconductor integrated circuit is equipped with a free pad 6 with which an output pad 4 and a characteristics check element 1 are connected, and the free pad 6 is connected with a free pin of a product by bonding. After assembly, a current and a voltage are applied to the free pin, and characteristics check is enabled by using the characteristics check element 1. A plurality of pads for probes are unnecessary, an area occupied by the characteristics check element 1 is small, and it is facilitated to involve all necessary check elements 1 in a chip of small area. Characteristics can be measured without opening a package.
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