| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for detecting optimizing conditions of flip-chip bonding by which the optimum pressure and heating temperature can be detected easily, when performing flip-chip bonding by using a bonding material. SOLUTION: The pressure applied to a semiconductor chip is raised at a first prescribed rate so as to press a semiconductor chip against a substrate, until the contact resistance between the bump of a semiconductor chip and the pad of the substrate through a bonding material, such as an anisotropic conductive film, etc., reaches a first set value or lower and the heating temperature of the semiconductor chip is raised at a second prescribed rate, until the temperature of the chip reaches a set value or higher. When the contact resistance reaches the first set value or lower, and in addition, the temperature of the chip reaches the set value or higher, the pressure applied to the chip and the heating temperature of the chip are fixed and, after a prescribed period of time has elapsed under the same condition, the pressure and heating temperature are reduced. |
