| 摘要 |
<p>PROBLEM TO BE SOLVED: To positively confirm filled state by surely filling the space between a wiring substrate and a semiconductor element with a bonding agent. SOLUTION: A wiring substrate 1 and a semiconductor element 4 are jointed via electrodes 3 and 5, and the semiconductor element is mounted on the wiring substrate 1. A hole 7 is opened on the wiring substrate 1, a bonding agent 8 is injected into a space 6, where it is formed between the wiring substrate 1 and the semiconductor element 4, its periphery is opened through a hole 7, and the injected bonding agent 8 is makes tight contact with the surface facing the wiring substrate 1 of the semiconductor element 4, and it is entirely replaced with the air in the space 6. The bonding agent 8 flows on the rear surface of the semiconductor element 4 to run over its periphery. By confirming flow out of it, for confirming perfect fulfillment of the bonding agent is confirmed.</p> |
