发明名称 MANUFACTURE OF LOW CONTAMINATION INTERCONNECTION HAVING LOW-INDUCTANCE PERIPHERY
摘要 PROBLEM TO BE SOLVED: To reduce the inductance of an interconnection by removing a conductive material from facing areas on the internal surface of an opening around a plated portion and cutting a substrate along a line extended across the facing areas so as to expose the coated and plated internal surface of the opening as a peripheral electric interconnection. SOLUTION: The PWBs 50 on both surfaces of a substrate coated with a metallic flash 52 are bored for making one or more holes or biases 54 and deburred. In order to provide notches 60 which are faced oppositely to each other, notching or prerouting is performed on the ends of a narrow and long hole 54. The notches 60 provide the hole 54 associated with an internal surface portion 58 not coated with the metallic flash 56. Then circuit components are attached to a PWBs 50 by cutting or routing the PWBs 50 along the notches 60 and routes passing through a metallic strip 68.
申请公布号 JP2000114715(A) 申请公布日期 2000.04.21
申请号 JP19990269665 申请日期 1999.09.24
申请人 LUCENT TECHNOL INC 发明人 ROY APURBA
分类号 H05K1/11;H05K1/14;H05K3/00;H05K3/34;H05K3/40;H05K3/42;(IPC1-7):H05K3/40 主分类号 H05K1/11
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