| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting semiconductor device by which semiconductor devices and conductor patterns on the front and rear surfaces of a substrate can be connected easily to each other and the manufacturing cost of the substrate can be reduced, and the semiconductor devices can be mounted efficiently on the substrate. SOLUTION: A method for mounting a semiconductor device includes a first process, in which ball bumps 5 are formed outside the connecting terminals 2 which are respectively arranged on semiconductor devices 1 by sucking preformed metallic balls to press-contacting tools 6 and bonding the balls to the terminals 2, a second process in which a base material 8, having through- holes 13 at the positions corresponding to the ball bumps 5, is aligned with the semiconductor devices 1 and fixed to the devices 1 with a bond 10, and a third process in which the metallic balls are put on the ball bumps 5 in batch and bonded to the bumps 5. In this method, electrical continuity between the semiconductor devices 1 and a plurality of conductor patterns arranged on the substrate is obtained at the same time. |
