发明名称 WIRE BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain an accurate wire loop form by a method wherein, after a ball is bonded to a first bonding point, a capillary is made to ascend while drawing out a wire from the tip, moved in the direction of a second bonding point, and then made to ascend upward. SOLUTION: After a ball formed at a wire tip is bonded to a first bonding point A, a capillary 4 ascends up to a point B while drawing out a wire 3. The capillary 4 moves from the point B to a point C in the direction of a second bonding point G. Next the capillary 4 ascends up to an obliquely upward point D in the direction of a second bonding point G, while drawing out the wire 3. The capillary 4 descends, moves, pulls the wire 3 and gives it tension. A bulge in the lower part of a wire form 34 is absorbed, and a wire form 35 having an ideal wire length is obtained. Thereby an accurate wire loop form of a low wire loop or a short wire loop can be realized.
申请公布号 JP2000114303(A) 申请公布日期 2000.04.21
申请号 JP19980276695 申请日期 1998.09.30
申请人 SHINKAWA LTD 发明人 NISHIURA SHINICHI;MOCHIDA TORU
分类号 H01L21/60;B23K20/00;H01L21/607 主分类号 H01L21/60
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