| 摘要 |
PROBLEM TO BE SOLVED: To protect a contact of a gold wire and a second electrode and exclude imperfect contact, by bonding the tip of a loop gold wire formed on a first electrode to a second electrode facing the first electrode. SOLUTION: An aluminum electrode 2 is divided into arrangement 4, arrangement 5, arrangement 6 and arrangement 7, and arranged on the periphery of an IC1. Loop surfaces of gold wires 3 are arranged to become parallel with each other in adjacent aluminum electrodes 2 in the same arrangement. Loop surfaces of facing gold wires 3 in the arrangement 4 and the arrangement 6 and in the arrangement 5 and the arrangement 7 face each other. By this arrangement, distance between adjacent gold wires 3 can be made long, so that elastic deformation stress due to difference of coefficients of thermal expansion between an IC chip and a substrate can be relieved. Thereby short-circuit failure is hard to be generated and high density packaging is enabled. |
