| 摘要 |
PROBLEM TO BE SOLVED: To attain improvement in electric characteristics such as high frequency characteristics, miniaturization, reduction in man-hours for assembly, cost-down and improvement in impact resistance. SOLUTION: Concerning a main body 4 of an oscillator, a SAW resonator forming area 1A for forming a SAW resonator 2 and an IC chip mounting area 1B for mounting an IC chip 3 for driving the SAW resonator 2 adjacently to this SAW resonator forming area 1A are provided on a piezoelectric substrate 1, the SAW resonator 2 is formed in the SAW resonator forming area 1A and the flip chip mounting of the IC chip 3 is performed in the IC chip mounting area 1B. This main body 4 of oscillator is housed and fixed in a package and the upper opening of the package is sealed with a lid.
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