| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces dispersion in flattening by using new design rules and improves product yield. SOLUTION: In a semiconductor device, wherein a projecting part 12 which is necessary for circuit operation, is arranged and formed in irregular distribution in a semiconductor board 11, and a film to be flattened which is embedded at least in a circumference of the projecting part 12 and flattens the entire arrangement surface of the projecting part 12, is formed, a first dummy projection part 13 of a fixed configuration which is unnecessary for circuit operation is arranged periodically in a region, where the distribution of the projecting part 12 is thin and a second dummy projection part 14 of an arbitrary configuration which is unnecessary for circuit operation is arranged in a region, which is not embedded by the arrangement of the first dummy projection part 13.
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