| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method with which the bonding time can be shortened without damaging the neck section of the wire by making the locus of a capillary simple and little in the moving amount of the capillary, and a low wire loop having an overall height of 200 μm or smaller can be formed stably by stabilizing the height of the wire loop as a whole. SOLUTION: After a ball formed at the front end of a wire 3 extending from the front end of a capillary 4 is bonded to a first bonding point A, the capillary 4 is raised to a point B and moved to a position C which is obliquely above a point B in the direction of a second bonding point G. The capillary 4 is moved up to a position D which is obliquely above the position C in the direction opposite to the second bonding point G and in recession is moved to a position E obliquely above a position D in the direction of the second bonding point G. Successively, the capillary 4 is lowered, and the wire 3 is bonded to the second bonding point G. |
