| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which is made compact and thin. SOLUTION: First infrared rays emitted from a first semiconductor chip 13 are reflected on a reflecting surface 16a on a V-shaped groove 17, and emitted through a lens 18 from the side face of a resin sealed body. Second infrared rays emitted from a second semiconductor chip 14 are reflected on a reflecting surface 16b, and emitted through the lens 18 from the side face of the resin sealed body. Moreover, the first and second semiconductor chips 13 and 14 are driven by different power supply voltages. |
