| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield in manufacturing a semiconductor device, for a semiconductor manufacturing device wherein a resin package is formed only on the one side surface of a lead frame. SOLUTION: For a semiconductor manufacturing device comprising a gate break mechanism 80 where a resin mold 20 (a configuration body where a plurality of resin sealing bodies 20A, where a resin 22 which is to be a resin package is formed on a lead frame 21 are connected by a gate 24 and a cull 23) is clamped by a lead frame clamper 83 before a gate-break process with the gate 24, and then separated into individual resin-sealing body 20A, the laed frame clamper 83 is so configured as to clamp only a position near the gate of the lead frame 21 at gate breaking while being separated from the resin 22. |
