TEMPERATURE ADJUSTING STAGE OF BOARD AND POWER CIRCUIT THEREFOR

摘要

PROBLEM TO BE SOLVED: To reduce a cost of processing equipment by reducing maximum electric power required for processing a board. SOLUTION: In a backing process of a resist of a semiconductor wafer, a power circuit charges a capacitor 39 with electric power from an external AC power source 31 in a cooling and low temperature period t0 (t3). Charging electric power is supplied to a sub-heater 23B from the capacitor 39 in a temperature rising period t1 requiring large electric power, and electric power from the AC power source 31 is supplied to a main heater 23A.