| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which is made compact and thin. SOLUTION: An infrared ray made incident to the side face E of a resin sealed body 20 is received by a light receiving element 14, and the output currents of the light receiving element 14 are converted into a voltage by a current/voltage converting circuit 15 formed on a first semiconductor chip 17 on which the light receiving element 14 is also formed. Moreover, an input signal to be transmitted is impressed to a driving circuit 16 for light emission, and a driving signal is impressed to a second semiconductor chip 19, and a light emitting element 18 in the second semiconductor chip 19 is driven so that an infrared ray can be emitted. |
