| 摘要 |
PROBLEM TO BE SOLVED: To provide a die-bonding method capable of improving productivity by performing reliable die-bonding, without damaging semiconductor elements with a small number of steps and within a short time. SOLUTION: A wafer sheet 2, having the back surfaces of thermosetting adhesive layers 43 adhered to both surfaces thereof, is diced. The width of each of dividing grooves 41 is increased by expanding the sheet 2. In such a condition, a semiconductor element 3 is positioned on a die pad 30 at a distance from the pad 30. A die bond head 4, having a compressed air passage 5 and a cutting blade 6, is lowered to thereby cut the sheet 2 into a single element at the corresponding width-increased dividing grooves. Then, compressed air is jetted from the passage 5, thereby press contacting the element 3 and adhering the layer 43 of the sheet 2 onto the surface of the pad 30. |
