| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent generation of particles caused by a sliding robot hand on a substrate, by calculating the position of a substrate center by measuring the distance between the outer peripheral part of the substrate and a sensor while horizontally rotating once a rotary table. SOLUTION: After a substrate W held by a robot hand 10 is mounted on a mounting table 24 in a positioning chamber 18, the hand 10 is drawn out from the positioning chamber 18. In this state, a rotary table 26 and the substrate W are made to ascend, a distance as far as the outer peripheral part of the substrate W is continuously measured with a sensor 28 rotating 360 degrees. Next the substrate W is delivered to the hand 10 in the state that the position of the substrate W is adjusted to the hand 10. The position of the center of the substrate W is calculated with an operation processing unit and inputted in a control unit of the hand 10. The hand 10 is inserted in a gap to the rotary table 26. After the position is so adjusted in a plane that the center of the hand 10 coincides with the center of the wafer W, the substrate W is made to ascend and held. The substrate W is carried in a substrate treatment chamber 20 and positioned on the mounting table 24.</p> |
