发明名称 LEAD FRAME TRANSFER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a lead frame transfer device for stable transfer of a lead frame. SOLUTION: A heat block 5 of a lead frame transfer part 2 comprises a heat block main body 5a and a heat block guide member 5b. Inside the heat block main body 5a, a transfer rail 6 for transferring a lead frame is provided. A leg part 4 comprises a leg part main body 4a and a leg part guide member 4b. Between the heat block guide member 5b and the leg part guide member 4b, a steel ball 9 is provided, which guides the extension of the heat block 5 in length direction. Since the steel ball 9 rolls when the heat-expanded heat block 5 extends, the heat block 5 can be extended linearly in the length direction.
申请公布号 JP2000114279(A) 申请公布日期 2000.04.21
申请号 JP19980294495 申请日期 1998.10.01
申请人 NIDEC TOSOK CORP 发明人 KOYAMA MASAHIRO
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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